United Microelectronics Corporation (UMC) partners with AP Memory on power delivery for AI/HPC
United Microelectronics Corporation (UMC) announced a collaboration with AP Memory to develop silicon capacitor-based power delivery for AI and HPC systems. AP Memory's S-SiCap Gen2D completed tape-out and initial wafer validation. The next step will be system-level testing in substrate packages, according to the press release distributed by PR Newswire.
In 25 seconds
- UMC and AP Memory are collaborating on silicon capacitor-based power delivery for AI and HPC.
- AP Memory's S-SiCap Gen2D completed tape-out and initial wafer validation.
- The next stage is system-level testing in substrate packages.
IASummary generated by artificial intelligence from a story by TradingView. It may contain errors: the original source prevails.




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